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| HLMP-NS31 and HLMP-NM31 T- (3mm) InGaN LED Lamps Data Sheet Description These InGaN lamps are designed in industry standard package with clear and non-diffused optics. These lamps are ideal for use as indicator and for general purpose lighting. Features * General purpose LED * Reliable and rugged * Binned for color and intensity * Bright InGaN dice Package Dimensions 4.40 0.30 3.10 0.20 Applications * Status indicator * Small message panel * Running and decorative lights for commercial use * Back lighting * Consumer audio 3.50 0.30 2.00 5.85 0.50 0.65 MAX. 23.0 MIN. + 0.10 0.45 - 0.04 1.0 MIN. 2.54 0.30 0.44 0.20 3.40 0.20 + 0.10 0.40 - 0 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. CATHODE MARKS Caution: DeviCes are Class 1 esD sensitive. Please observe aPProPriate PreCautions During hanDling anD ProCessing. refer to aPPliCation note an-1142 for aDDitional Details Selection Guide Part Number HLMP-NS3-J00xx HLMP-NM3-R00xx Color and Dominant Wavelength d (nm) Typ. Blue 470 Green 59 Luminous Intensity, Iv (mcd) at 20 mA Min. 40 500 Typ. 600 800 Viewing Angle, 21/2 (degree) 30 Tinting Type Un-tinted; non-diffused Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package 2. The tolerance for intensity limit is 15% 3. The optical axis is closely aligned with the package mechanical axis 4. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp. Absolute Maximum Ratings, TA =25C Parameter DC Forward Current [] Peak Forward Current Reverse Voltage (IR = 0A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Notes: 1. Derate linearly as shown in Figure 5 Blue /Green 30 00 5 5 -40 to +85 -40 to +85 Unit mA mA V C C C Electrical/Optical Characteristics Parameter Forward Voltage Reverse Voltage Dominant wavelength Peak wavelength Thermal Resistance Symbol VF VR d peak RJ-PIN NS3 NM3 NS3 NM3 Min. 3.0 5 460 50 470 59 464 59 90 480 540 Typ. 3.3 Max. 4.0 Units V V nm nm C/W Test Condition IF = 0 mA IR = 0 A IF = 0 mA Peak of wavelength of spectral distribution at IF = 0 mA Notes: 1. The dominant wavelength d is derived from the Chromaticity Diagram and represents the color of the lamp. 2. Tolerance for each color bin limit is 0.5 nm 1.0 0.9 0.8 1.0 0.9 0.8 RELATIVE INTENSITY 430 480 WAVELENGTH - nm 530 580 RELATIVE INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 400 450 500 550 WAVELENGTH - nm 600 650 Figure 1. Relative Intensity vs wavelength for HLMP-NS31 Figure 2. Relative Intensity vs wavelength for HLMP-NM31 30 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 25 FORWARD CURRENT - mA 20 15 10 5 0 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 DC FORWARD CURRENT - mA 30 35 0 1 2 FORWARD VOLTAGE - V 3 4 Figure 3. Forward Current vs Forward Voltage Figure 4. Relative Intensity vs Forward Current 40 1 0.9 0.8 IF - FORWARD CURRENT - mA 30 NORMALIZED INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 20 RJ-A=780C/W 10 0 0 20 40 60 80 VF - FORWARD VOLTAGE - VOLTS 100 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES 60 90 Figure 5. Maximum Forward current vs Ambient temperature based on TJ=110C Figure 6. Radiation pattern 3 Intensity Bin Limit Table Intensity (mcd) at 20 mA Bin J K L M N P Q R S T U Min 40 30 400 50 680 880 50 500 900 500 300 Max 30 400 50 680 880 50 500 900 500 300 400 Green Color Bin Limit Table Dominant Wavelength (nm) at 20 mA Bin 3 4 5 Min 50 54 58 53 536 Max 54 58 53 536 540 Tolerance for each bin limit is 0.5nm Tolerance for each bin limit is 15% Blue Color Bin Limit Table Intensity (mcd) at 20 mA Bin 3 4 5 Min 460 464 468 47 476 Max 464 468 47 476 480 Tolerance for each bin limit is 0.5nm 4 Precautions: Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attached and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. * Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25 C before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through hole size for LED component leads: LED component lead size 0.457 x 0.457 mm (0.05 inch) 0.508 x 0.508 mm (0.08 inch) Diagonal (0.08 x 0.08 inch) 0.976 to .078 mm (0.00 x 0.00 inch) .049 to .50 mm Plated through hole diameter 0.646 mm (0.038 to 0.04 inch) 0.78 mm (0.04 to 0.045 inch) Soldering Condition: * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoffs. * Recommended soldering condition: Wave Soldering Pre-heat temperature Pre-heat time Peak temperature Dwell time 05 C Max. 30 sec Max. 50 C Max. 3 sec Max. Manual Solder Dipping 60 C Max. 5 sec Max. Note: Refer to application note AN1027 for more information on soldering LED components. TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE 200 TEMPERATURE - C BOTTOM SIDE OF PC BOARD 150 FLUXING 100 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA PREHEAT 10 20 304 0 50 607 0 809 0 100 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. TIME - SECONDS TOP SIDE OF PC BOARD 50 30 0 5 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 007 Avago Technologies Limited. All rights reserved. AV0-0044EN - January 5, 007 |
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